Packaging problem is one of the challenging problems in the electromagnetic simulations since it usually includes many fine structures inside. Since the thickness and loss of the very thin circuits have to be taken into account, therefore, it requires huge compute power and memory to accurately simulate this type of problems. GEMS provides an ability to design the distribution of the processors in a cluster to efficiently simulate this type of problems. Since the huge problem is hard handled by serial version of graphical interface, GEMS includes a special module which combines the domain decomposition technique with the GEMS designer to efficiently and fast generate the conformal mesh and material distribution. In addition, GEMS designer offers a powerful conformal mesh checking module which allows the user to dynamically check whether the conformal mesh is good.

This is a 8-layers package, which has a dimension from -10.6 mm to 1.1 mm in the x-direction, from -17.3 mm to 3.950 mm in the y-direction, and from -0.140 mm to 0.872 mm in the z-direction. The computational domain is discretized into 1670x1755x121 (354 million) uniform cells. It took 11 hours 3 minutes for 80,000 time steps in GEMS HPCC using 96 processors.